| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-362 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-0025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-009 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-362 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 |
| filingDate |
2020-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abcd8b0e07f77658741f032866e7a2ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03b8edeb7ee933c5d4bcaff8ed6292b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f451bf1e2527fd714adaf618b9af943
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_120c80874faadbabe7949acf9d6ac6a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15e6d3e1131d05f33ef11d7f0ef40ea9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cb58ebce033da25995016a4088b1fe9 |
| publicationDate |
2021-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11052481-B2 |
| titleOfInvention |
Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching |
| abstract |
A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w 0 , and a Rayleigh range Z R that is greater than n F D π w 0 2 λ , nwhere F D is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023064069-A1 |
| priorityDate |
2019-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |