| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 |
| filingDate |
2017-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fb2b0dd60adbf0261465cbb0ea3870a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecf5696f1d524c02edae6c1552ab18f9 |
| publicationDate |
2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11043461-B2 |
| titleOfInvention |
Semiconductor device having an electromagnetic wave absorbing thermal conductive sheet between a semiconductor element and a cooling member |
| abstract |
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20. |
| priorityDate |
2016-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |