Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-187 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate |
2015-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e2c715bbb779eb4dc1a777bf5d3f663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_655ae29af9b593ce587fa5013a80769f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da8e5f7279951e796b974189caeaa8a3 |
publicationDate |
2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11037904-B2 |
titleOfInvention |
Singulation and bonding methods and structures formed thereby |
abstract |
Methods of singulation and bonding, as well as structures formed thereby, are disclosed. A method includes singulating a first chip and after the singulating the first chip, bonding the first chip to a second chip. The first chip includes a first semiconductor substrate and a first interconnect structure on a front side of the first semiconductor substrate. The singulating the first chip includes etching through a back side of the first semiconductor substrate through the first interconnect structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11735497-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020126894-A1 |
priorityDate |
2015-11-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |