| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0837
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2019-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d148e81955e3bf865f4fa390e931bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3eed41a1b93809ef859661f31b00286 |
| publicationDate |
2021-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11028262-B2 |
| titleOfInvention |
Resin composition, anisotropic conductive film including the same, and electronic device |
| abstract |
Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group. |
| priorityDate |
2018-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |