| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bcb788ac2ea1a772ff0a53a49e5e2375 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1804 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 |
| filingDate |
2018-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a6fb933eebb12f33cf1c6dd9fc09c6b |
| publicationDate |
2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11018272-B2 |
| titleOfInvention |
Methods for forming metal electrodes concurrently on silicon regions of opposite polarity |
| abstract |
A method for concurrently forming a first metal electrode (31, 58) on an n-type region of a silicon substrate (10) and a second metal electrode (32, 59) on a p-type region of the silicon substrate, wherein the n-type region and the p-type region are respectively exposed in a first and in a second area, is disclosed. The method comprises: depositing (101) an initial metal layer comprising Ni (33, 53) simultaneously in the first area and in the second area by a Ni immersion plating process using a plating solution; and depositing (102) a further metal layer (34, 54) on the initial metal layer comprising Ni (33, 53) in the first area and in the second area by an electroless metal plating process or by an immersion metal plating process, wherein the plating solution comprises Ni and a predetermined amount of another metal different from Ni. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112186067-A |
| priorityDate |
2017-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |