| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80973ca8e1b3acbac7208592978d413c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32059
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-2003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-26145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-3207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83365
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2019-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca556b12c094daee24a22436069e9663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3c774bbb83fb5a0772b0083e9d86623 |
| publicationDate |
2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10957591-B2 |
| titleOfInvention |
Process of forming semiconductor device |
| abstract |
A process of forming a semiconductor device is disclosed, where the semiconductor device provides a substrate. The process includes steps of: (a) depositing a first metal layer containing nickel (Ni) on a secondary surface of the substrate and within a substrate via provided in the substrate; (b) depositing a second metal layer on the first metal layer by electrolytic plating; (c) depositing a third metal layer on the second metal layer, where the third metal layer contains at least one of Ni and titanium (Ti); (d) exposing the second metal layer in a portion that excepts the substrate via and a periphery of the substrate via by partly removing the third metal layer; and (e) die-bonding the semiconductor device on an assembly substrate by interposing solder between the secondary surface of the substrate and the assembly substrate. |
| priorityDate |
2018-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |