| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2551e9aa05784c40232f95d00090f5da |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2009-0007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2009-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-0036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-155 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-00 |
| filingDate |
2019-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c60e3f26ecb1d13547ac624e67eea0d |
| publicationDate |
2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10950390-B2 |
| titleOfInvention |
Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer |
| abstract |
A stacked type capacitor without carbon paste layer includes a metal foil, an oxide layer, a polymer composite layer and a silver paste layer. The oxide layer is formed on the outer surface of the metal foil to entirely enclose the metal foil. The polymer composite layer is formed on the oxide layer to partially enclose the oxide layer. The silver paste layer is directly formed on the polymer composite layer to directly enclose the polymer composite layer. The oxide layer and the polymer composite layer are connected with each other to form a first connection interface between the oxide layer and the polymer composite layer. The polymer composite layer and the silver paste layer are connected with each other without a carbon paste layer to form a second connection interface between the polymer composite layer and the silver paste layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11404218-B2 |
| priorityDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |