http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10932394-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_340649364548937a01cef840349f4fca |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20854 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2018-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbeb881fbf2ca8f7a09944e528ecb0a5 |
| publicationDate | 2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-10932394-B2 |
| titleOfInvention | Electronics housing with heat sink |
| abstract | An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal. |
| priorityDate | 2017-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.