| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ce9514e9e5483ea14917fe0400bf92eb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-02 |
| filingDate |
2017-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71a4d7c99af47fdcfdf9e4bf45f99ef9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9ffba704460de840c0598307eb02fb1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fb97709059ca19801d6af4bba4bc240
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_467611b4c0151fa6953d86bf8db6b5c3 |
| publicationDate |
2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10927254-B2 |
| titleOfInvention |
Polyamide moulding compounds with low relative permittivity |
| abstract |
Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones. |
| priorityDate |
2016-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |