| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54426 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14696
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14634
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 |
| filingDate |
2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f514f696b4cafb07b4e67dd92e49da9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_832623f2dab29dafd35384a9ab192483 |
| publicationDate |
2021-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10923524-B2 |
| titleOfInvention |
Support for forming an optoelectronic component, optoelectronic component and method for manufacturing such a support and such a component |
| abstract |
The invention relates to a method for manufacturing a first support (100) for forming, in particular with a functionalised second support (200), an optoelectronic component (1), the first support (100) comprising a semiconductor layer (110) and an alignment mark (140) provided on said semiconductor layer (110). The manufacturing method includes in particular a step of forming an aperture (141) in a semiconductor layer (110) comprising cadmium, a step of diffusing cadmium in a second location (142) of the aperture (141) and a cadmium sensitive etching step for promoting etching of one from the second location (142) which is rich in cadmium and the rest of a surface (110B) of the semiconductor layer (110). The invention also relates to a first support (100). |
| priorityDate |
2018-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |