| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_751430a32763964dbc7195a2d58cffbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D2021-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D20-021 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4275
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F13-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D20-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28F13-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28D21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433 |
| filingDate |
2019-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e12988f34f523d8c3e333c19ae2686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ba7168c829dd654f57cf41c0d2740a8 |
| publicationDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10890387-B2 |
| titleOfInvention |
Heat sinks with vibration enhanced heat transfer |
| abstract |
The heat sinks with vibration enhanced heat transfer are heat sinks formed from a first body of high thermal conductivity material. The first body of high thermal conductivity material is received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be a liquid heat source, including but not limited to water. The thermally conductive housing is disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink. |
| priorityDate |
2018-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |