| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d629238b5c0aada2fc57fa5dbb59a41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7b27e237c8bb68513f61ba601eb85bee |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6638
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4823
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49433 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0243 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2018-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baa1269848b78b41b8ef68d671dfe8e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cb8c74652b90161ab234fd7e950af6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc4af4b2b0a659e7feb27215e269ba66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17c6963567c637ae549d1e40578ebe2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a0d4552cb6faf44e04826d68747a609 |
| publicationDate |
2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10880991-B2 |
| titleOfInvention |
Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package |
| abstract |
Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board. |
| priorityDate |
2018-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |