| abstract |
The present disclosure provides systems and methods that employ slurries to form layers adjacent to substrates. Such layers can include, for example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, oxides thereof, nitrides thereof, sulfides thereof, or combinations thereof. In some examples, such layers are stainless steel layers. |