| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-18 |
| filingDate |
2018-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48a0cae99250ac60fef553d1decaf59b |
| publicationDate |
2020-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10858544-B2 |
| titleOfInvention |
Chemical mechanical polishing slurry and chemical mechanical polishing process using the same |
| abstract |
The present disclosure provides a chemical mechanical polishing (CMP) slurry including a Lewis acid which is in dissolved form, and a chemical mechanical polishing (CMP) process using such CMP slurry. The present disclosure further provides an abrasive-free chemical mechanical polishing (CMP) slurry including a Lewis acid which is in dissolved form. |
| priorityDate |
2018-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |