| abstract |
[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm2; and to cooling and solidification. |