| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2029-7858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823418 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-456
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-41791
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823475
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823418
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823431 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 |
| filingDate |
2018-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_826b4a7de7875602d334b86fca131fc2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae1bef5f136bcc22ef9b8ccd681ab804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e98568cbe58287c3fc6e3040aaba6fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_348326ab514983573664efae62e36689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e08d91ff19fce642276d4cd68e163970
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d16c7e035b4c0a6607a1db2b7d09c4e7 |
| publicationDate |
2020-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10840345-B2 |
| titleOfInvention |
Source and drain contact cut last process to enable wrap-around-contact |
| abstract |
A technique relates to a semiconductor device. A source or drain (S/D) contact liner is formed on one or more S/D regions. Annealing is performed to form a silicide layer around the one or more S/D regions, the silicide layer being formed at an interface between the S/D contact liner and the S/D regions. A block layer is formed into a pattern over the one or more S/D regions, such that a portion of the S/D contact liner is protected by the block layer. Unprotected portions of the S/D contact liner are removed, such that the S/D contact liner protected by the block layer remains over the one or more S/D regions. The block layer and S/D contacts are formed on the S/D contact liner over the one or more S/D regions. |
| priorityDate |
2018-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |