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publicationDate 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10833128-B2
titleOfInvention Reducing junction leakage and occurrence of dark current at a contact portion of a solid-state image device
abstract There is provided a solid-state imaging device including a semiconductor base element, an organic photoelectric conversion layer formed above the semiconductor base element, a contact hole formed in an insulating layer on the semiconductor base element, a conductive layer formed in the contact hole and electrically connecting a photoelectric conversion part which includes the organic photoelectric conversion layer with the semiconductor base element, and a contact portion which is formed by self-alignment with the conductive layer in the contact hole in the semiconductor base element, and connected to the conductive layer.
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