Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B2005-0021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-00813 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B15-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B33-144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-3153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-00813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B25-06 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B33-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B15-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31 |
filingDate |
2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14f228ab7a46f70f5d703b01c746fb32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a25422338371334c69e1cd941be9a0bb |
publicationDate |
2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10832740-B2 |
titleOfInvention |
Multichannel tape head module having embedded thermal device |
abstract |
In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot. |
priorityDate |
2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |