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filingDate 2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14f228ab7a46f70f5d703b01c746fb32
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publicationDate 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10832740-B2
titleOfInvention Multichannel tape head module having embedded thermal device
abstract In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.
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