Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
A production method for a polyimide with a black resin cured film includes a process of obtaining the black resin cured film by curing a black resin composition on the polyimide. The process of obtaining the black resin cured film includes a process of processing the black resin composition with a predetermined spray impact. A distance from a point where a line that is perpendicular to a surface of the polyimide and that passes through a substrate-adhered edge between the black resin cured film and the polyimide intersects a top portion of the black resin cured film to an edge of the top portion is 25 μm or less.