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publicationDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10818517-B2
titleOfInvention Semiconductor package structure and a method of manufacturing the same
abstract A method for manufacturing a semiconductor package structure includes providing a semiconductor chip, encapsulating the semiconductor chip via a package body, the package body having a first surface opposite to a second surface, and coating a first self-assembled monolayer (SAM) over the first surface and the second surface of the package body.
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