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filingDate 2019-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10817701-B2
titleOfInvention Electronic device including sensor
abstract An electronic device is provided. The electronic device includes a fingerprint sensor including a sensor having a surface including epoxy molding compound (EMC) resin, a first layer disposed on the surface of the sensor or above the surface of the sensor, and a second layer disposed on the first layer or above the first layer. The first layer includes a first ultraviolet (UV) hardening material having first hardness. The second layer includes a second UV hardening material having second hardness greater than the first hardness and a surface of the second layer has surface roughness less than a specified value.
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