| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9bb81eb4c72593d635f7277e8ebdaa58 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
| filingDate |
2017-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67905c9ec8029615f50779c00a1699eb |
| publicationDate |
2020-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10815389-B2 |
| titleOfInvention |
Photosensitive and via-forming circuit board |
| abstract |
A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole. |
| priorityDate |
2017-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |