| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_37cfee68d0d572110669b12c4fc897ea |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-04 |
| filingDate |
2017-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1145ac7dc5236004d0d9df6174bf4839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f5e9ca5df4c404fcd7ed27af8a2ab04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5bcc2067fb98a571471057206f697cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d5bda7e76f4201919e4ed805a9201c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f2b102a5137366ebf61152ae9b9573d |
| publicationDate |
2020-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10793421-B2 |
| titleOfInvention |
Wafer level encapsulation for MEMS device |
| abstract |
A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11674803-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11579033-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11287486-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020084892-A1 |
| priorityDate |
2017-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |