| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-8833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-2436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L43-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N50-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B61-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B63-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C11-16 |
| filingDate |
2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3982b5c700cf0fa6734a13eba3544c8c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74b6add13d31c09e57042ad729200e63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0513b516ff01ca59b3f94991705f08d0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4233a5daa977a688cbf81fbbfd1090b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42574d89b6ea22482c6c78cf8259ba50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebb754c42bb0a5a1dfc38de6db5372b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae1188979aa72d3067133c4fe7c24bce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e1fe9b604bfca8ccd9567fee42799ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b964903e5abc4e6e9ce6f3866bd2515c |
| publicationDate |
2020-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10770345-B2 |
| titleOfInvention |
Integrated circuit and fabrication method thereof |
| abstract |
A method for fabricating an integrated circuit is provided. The method includes depositing a first polish stop layer above a memory device, in which the first polish stop layer has a first portion over the memory device and a second portion that is not over the memory device; removing the second portion of the first polish stop layer; depositing an inter-layer dielectric layer over the first polish stop layer after removing the second portion of the first polish stop layer; and polishing the inter-layer dielectric layer until reaching the first portion of the first polish stop layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11017852-B2 |
| priorityDate |
2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |