Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_70ca3ea7752cc2ae9b2687d93d702a99 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-042 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
filingDate |
2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b0b9d0a851811db73688823c86a29c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5181d7765405b21d3b328ee1297ba097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613e2ebb1fbeb3ab0aa01bed53bf4352 |
publicationDate |
2020-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10756019-B1 |
titleOfInvention |
Systems providing interposer structures |
abstract |
A die-to-die interconnect structure includes an interconnect network including a plurality of metal interconnect layers. The interconnect network is configured to electrically couple a first die and a second die mounted on a top surface of the die-to-die interconnect structure. A first metal interconnect layer of the plurality of metal interconnect layers includes a plurality of ground lines and a plurality of signal lines distributed across the first metal interconnect layer according to a GSSG pattern. In some examples, adjacent signal lines within the first metal interconnect layer are separated by a dielectric region. In some embodiments, a second metal interconnect layer of the plurality of metal interconnect layers is disposed above the first metal interconnect layer and includes a plurality of configurable signal/ground lines. By way of example, each of the plurality of configurable signal/ground lines is disposed over the dielectric region and within the second metal interconnect layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557541-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023107106-A1 |
priorityDate |
2018-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |