http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10748822-B2

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filingDate 2019-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8b898f4341206e345c3a5832f102775
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publicationDate 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10748822-B2
titleOfInvention Method for manufacturing semiconductor device
abstract A method for manufacturing a semiconductor device having a trench gate structure is provided. In the method, a first voltage-current characteristic indicating a relation between the main current and the gate voltage under a first temperature is measured to calculate a first threshold voltage. A second voltage-current characteristic indicating a relation between the main current and the gate voltage under a second temperature different from the first temperature is measured to calculate a second threshold voltage. It is determined whether the semiconductor device is a non-defective product or a defective product based on whether a difference between the second threshold voltage and the first threshold voltage is larger than a determination threshold value.
priorityDate 2017-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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