| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc8391627fc41fa2829364fcc1a91559 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2203-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2323-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2425-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2325-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2423-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2323-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2423-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-228 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L25-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2019-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f11bd9a7a5309a443cf90e630470940c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4ad0435435df43da2c29284ac4bc09d |
| publicationDate |
2020-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10741471-B2 |
| titleOfInvention |
Highly compliant non-silicone putties and thermal interface materials including the same |
| abstract |
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00. |
| priorityDate |
2018-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |