| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5d961b7b0788125a1a21ac598c5f60b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20909
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2018-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b06727fb411146c351ca881b36fea480
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b1ec8e1f5588f8218af4761a021217a |
| publicationDate |
2020-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10728999-B2 |
| titleOfInvention |
Circuit boards and method to manufacture circuit boards |
| abstract |
A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly. |
| priorityDate |
2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |