| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-10061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-20084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-20081 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-0004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-001 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-00 |
| filingDate |
2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1871c24c735f73a5d430f18ada478b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afa17fa2831860fa9c978af5f362857a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc5e5fb3e968a691822b932f7e7d7fc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80c460e2b8665b09db9ed3458eaf5bf1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21aa3855c007b7ba5a4bb6fdf7918d2a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6eccde36587c11c0d7fa405e1211d0fa |
| publicationDate |
2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10699926-B2 |
| titleOfInvention |
Identifying nuisances and defects of interest in defects detected on a wafer |
| abstract |
Methods and systems fir identifying nuisances and defects of interest (DOIs) in defects detected on a wafer are provided. One method includes acquiring metrology data for the wafer generated by a metrology tool that performs measurements on the wafer at an array of measurement points. In one embodiment, the measurement points are determined prior to detecting the defects on the wafer and independently of the defects detected on the wafer. The method also includes determining locations of defects detected on the wafer with respect to locations of the measurement points on the wafer and assigning metrology data to the defects as a defect attribute based on the locations of the defects determined with respect to the locations of the measurement points. In addition, the method includes determining if the defects are nuisances or DOIs based on the defect attributes assigned to the defects. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022284167-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I801973-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10810733-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11748551-B2 |
| priorityDate |
2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |