| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6d6633072ae1953d02c24406f937a4c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d2e13227a15c713297ab82c16cb9c78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8941b9fa39b55eefcb54dc8b3e875a60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40173fb664a63ff8e78d2896980004b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84efa17fff6c243bf4d01bb3cc3c1b2a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7d547c09aa6f73aee07f0e0b60bdd16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4765ba40f836af4d1562d0d4c8b0470f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d30658f85310a950b73864e62fdab5b |
| publicationDate |
2020-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10692732-B2 |
| titleOfInvention |
CMP slurry and CMP method |
| abstract |
The current disclosure describes a metal surface chemical mechanical polishing technique. A complex agent or micelle is included in the metal CMP slurry. The complex agent bonds with the oxidizer contained in the CMP slurry to form a complex, e.g., a supramolecular assembly, with an oxidizer molecule in the core of the assembly and surrounded by the complex agent molecule(s). The formed complexes have an enlarged size. |
| priorityDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |