| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_72db723b52f8d7ca589a6c813125d4d9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D20-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D20-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-492
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28D20-02 |
| filingDate |
2018-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f1c71057f4ddb2114f7d59d4f737980 |
| publicationDate |
2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10685900-B2 |
| titleOfInvention |
Packaging of a semiconductor device with phase-change material for thermal performance |
| abstract |
A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10971431-B2 |
| priorityDate |
2018-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |