Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
filingDate |
2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_834ce2096b476944a599da065b335112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbf15733f1279209c23e17a8af185e06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27410f9370556d97d479d90a2a20de17 |
publicationDate |
2020-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10670964-B2 |
titleOfInvention |
Ruggedized solder mask material |
abstract |
Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device. |
priorityDate |
2017-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |