| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-2427
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B63-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-1233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N70-231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L45-1675 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-24 |
| filingDate |
2017-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_495c4d036d5d803af9bf830b191b5366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1993cee9aa56f2ed2bea1608adba7da3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_336c91afeb6928243aa863f7c65afbd1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e7fe633f31c0381aabab2162fd5c008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2b81407b291e90b21bf95d1984b86d3 |
| publicationDate |
2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10658580-B2 |
| titleOfInvention |
Semiconductor structures including multi-portion liners |
| abstract |
A method of forming a semiconductor structure. The method comprises forming a protective portion of a liner on at least a portion of stack structures on a substrate. The protective portion comprises a material formulated to adhere to the stack structures. A conformal portion of the liner is formed on the protective portion of the liner or on the protective portion of the liner and exposed materials of the stack structures. At least one of the protective portion and the conformal portion does not comprise aluminum. Additional methods of forming a semiconductor structure are disclosed, as are semiconductor structures including the liners comprising the protective portion and the conformal portion. |
| priorityDate |
2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |