| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a3d52eacd83e723ebd2ca61b598586c2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-10061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-95607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30148 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F30-398
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9503
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F17-5081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-30 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-956 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-00 |
| filingDate |
2018-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_606dea5bd77e6e50da707d1f574fc61d |
| publicationDate |
2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10620135-B2 |
| titleOfInvention |
Identifying a source of nuisance defects on a wafer |
| abstract |
Methods and systems for identifying a source of nuisance defects on a wafer are provided. One method includes detecting defects on a wafer by applying a hot threshold to output generated for the wafer by a detector of an inspection subsystem such that at least a majority of the detected defects include nuisance defects and determining locations of the detected defects with respect to design information for the wafer. In addition, the method includes stacking information for the detected defects based on the determined locations relative to a structure on the wafer such that the detected defects having the same locations relative to the structure are coincident with each other in results of the stacking. The method further includes identifying a source of the nuisance defects based on the results of the stacking. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11790515-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11379972-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11328435-B2 |
| priorityDate |
2017-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |