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filingDate 2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10584209-B2
titleOfInvention Photosensitive polyimide resin composition and method of manufacturing cover film using the same
abstract A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): n n n n n n n n n n n n wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.
priorityDate 2017-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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