| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1014 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate |
2016-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_319905d527776c37a99d1a4cc621e425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c106947dc2643c6d5c41201c395761a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41daa87c2b086eb9e4c3b72db380d7c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48bd3ff26439099c50672b43ce347861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cfb76bb469a323c10d2246c8973948a |
| publicationDate |
2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10512171-B2 |
| titleOfInvention |
Laminated body comprising metal wire layer, and manufacturing method therefor |
| abstract |
The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape. |
| priorityDate |
2015-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |