| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4238 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2015-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27deedcad85dc9316cd910b2d40b8fbb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_221fa27a9e1d176b998d6542f6ff59fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cda474f1bc68db4ae3463492369d5a3b |
| publicationDate |
2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10450405-B2 |
| titleOfInvention |
Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board |
| abstract |
A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive).n nUnsaturated bond concentration={(number of unsaturated bonds per molecule)/(molecular weight)}/(number of acid anhydride groups per molecule)×100 (1) |
| priorityDate |
2014-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |