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filingDate 2018-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10396157-B1
titleOfInvention Semiconductor device
abstract A semiconductor device includes semiconductor layer having first device region and second device region. A shallow trench isolation (STI) structure is in the semiconductor layer and located at periphery of the first and second device regions. A first and second insulating layers are on the semiconductor layer and respectively located in the first and second device regions. A first gate structure is located on the first insulating layer. A source region and a drain region are in the semiconductor layer and are located at two sides of the first gate structure. A gate doped region is in a surface region of the semiconductor layer in the second device region to serve as a second gate structure. A channel layer is located on the second insulating layer. A source layer and a drain layer are on the STI structure and are located at two sides of the channel layer.
priorityDate 2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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