| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-38 |
| filingDate |
2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8834e507dd004483107ef4f3a598be18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_96b155c647d7b8056cf10b7d6adbded2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_442222e4a0b2f4304588fc8640d1a2bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7485ed071351bf645398ebe18ed615d2 |
| publicationDate |
2019-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10381519-B2 |
| titleOfInvention |
Light emitting device package and lighting apparatus |
| abstract |
A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892296-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10748881-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10892297-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11552057-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11552061-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019165037-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11114499-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11756984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10784240-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11522008-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11522006-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11282981-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11527514-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11527513-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11527519-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886327-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289461-B2 |
| priorityDate |
2015-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |