| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7542cdde926ccc0ad7b27ea92c083088 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2315-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2202-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2001-133331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S156-924
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133331 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-1637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1333 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F1-16 |
| filingDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13c820ce230595486e3ce5542d629d76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_428bd9557fb8b7e96333ab5e8a169690
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01975b5730d9af652c9947426f731a22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8905193f645281398029acef8dde485d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4be19ff712c7d12909bb6c0cadec4d4 |
| publicationDate |
2019-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10369774-B2 |
| titleOfInvention |
Thermally conductive de-bonding aid |
| abstract |
Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device. |
| priorityDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |