| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2016-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_904ac481b068c2194b636e3a0f738372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_072f4b106b3997afd8b8ba00d77c5ab3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9943a2ad1cfd23f230bf869c481dc7e3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3dca9f173dfeabf19a217b6852286b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54ce52fe721d3f8d78aa937b6084f869
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fed7b48f3b434599e2d14d373206210 |
| publicationDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10358738-B2 |
| titleOfInvention |
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step |
| abstract |
Various embodiments herein relate to methods and apparatus for electroplating metal on a substrate. In many cases, an electroplating process may be monitored to ensure that it is operating within a pre-defined processing window. This monitoring may involve application of a controlled potential between the substrate and a reference electrode after the electroplating process is substantially complete (e.g., after recessed features on the substrate are substantially filled). The current delivered to the substrate during application of the controlled potential is monitored, and a peak current is determined. This peak current, often referred to herein as the potential-controlled exit peak current, can be compared against an expected range to determine whether the electroplating process is operating as desired. |
| priorityDate |
2016-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |