Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4c10e1e222f10a69411e659d01c18b83 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 |
filingDate |
2015-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30fc99b29e09a3f983af76879fc77333 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1158a7457db580025b015c4008c67e4c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf4a36e52a3e61f877f197dc68e5e1ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc37037a3f2826d911d1ee4ee37cc857 |
publicationDate |
2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10316421-B2 |
titleOfInvention |
Copper-nickel alloy electroplating bath |
abstract |
The present invention provides a copper-nickel alloy electroplating bath which contains (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a conductivity imparting agent, (d) a sulfur-containing organic compound and (e) a redox potential regulator. |
priorityDate |
2014-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |