| abstract |
A resin composition including at least (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, satisfies the following conditions:n (I-I) the minimum modulus is no greater than 10 4 MPa when evaluated at a set temperature of 200° C. after temperature increase from room temperature to 200° C. at 50° C./min by evaluation with a rheometer, and the final modulus is 10 5 MPa or greater from 10 minutes after the initial temperature increase; (I-II) the softening point of the epoxy resin (A) is 35° C. or higher; (I-III) the residual solvent in the resin composition is no greater than 0.1%; and (I-IV) the equivalent value of the curing agent (B) is no greater than 90 g/eq and the softening point is 105° C. or higher. |