Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
filingDate |
2015-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02c9d23236643ae379df1a4a0489746f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08146313ce45034c2518bf528bd55ca4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c3bc4360dde6f1543e45729f6c6accc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14cb090c8c2ff364393f9c5a9003d91e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8daeb44bf059a74aa6b993c41d05e3c4 |
publicationDate |
2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10290557-B2 |
titleOfInvention |
Selective metallization of an integrated circuit (IC) substrate |
abstract |
Embodiments of the present disclosure describe selective metallization of an integrated circuit (IC) substrate. In one embodiment, an integrated circuit (IC) substrate may include a dielectric material and metal crystals having a polyhedral shape dispersed in the dielectric material and bonded with a ligand that is to ablate when exposed to laser light such that the metal crystals having the ablated ligand are activated to provide a catalyst for selective electroless deposition of a metal. Other embodiments may be described and/or claimed. |
priorityDate |
2015-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |