| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_76435b5227550d22ea6fb5b4dd984c48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf72916a083b22b9133dbdaa900ccb61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8ffe788a84cb27580903241b5296e95b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61C19-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-813
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K6-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61C19-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K6-891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K6-884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K6-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K6-00 |
| filingDate |
2015-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1aeb8bac80df37f12d6bd2e6e5527db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5c421d7a78bfe8d9c0a368768d7e8b3 |
| publicationDate |
2019-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10285914-B2 |
| titleOfInvention |
Bonding method, bonding kit, and bonding material |
| abstract |
To enable firm bonding to a member including a polyaryl ether ketone resin. A bonding method including: a bonding material applying step for applying, to the surface of a member including a polyaryl ether ketone resin, a bonding material including (A) a polymerizable monomer and (B) at least a portion of components for configuring a polymerization initiator, the content ratio of polymerizable monomers at least having two or more polymerizable functional groups in a (p2) molecule among all polymerizable monomers being 50% by mass or greater, and the content ratio of polymerizable monomers at least having one or more polymerizable functional groups and one or more functional groups capable of hydrogen bonding in a (p1h1) molecule being 5% by mass or greater; and a curing step for curing the bonding material. A bonding material and bonding kit using the bonding method. |
| priorityDate |
2014-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |