Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57341227c065dbddd1d3cf801bbaa86a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02238 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088 |
filingDate |
2016-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b430d0c55244bf7cbcba0b1b633e878f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b145c421d5b59f9567a112f16fe70a1d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d434a402a9a572f40a18893eaddaf23e |
publicationDate |
2019-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10276563-B2 |
titleOfInvention |
Semiconductor devices and methods for forming the same |
abstract |
A semiconductor device and a method for forming the same are provided. The method includes forming a patterned mask on a substrate, wherein the patterned mask includes a pad oxide layer and a silicon nitride layer over the pad oxide layer. The method also includes forming a trench in the substrate by performing a first etching process on the substrate through an opening of the patterned mask and forming a dielectric material layer in the trench, in the opening, and on the patterned mask. The method further includes performing a planarization process to remove the dielectric material layer outside of the trench, and performing a heat treatment process to form an oxidized portion at the interface of the pad oxide layer and the substrate and adjacent to the dielectric material layer. |
priorityDate |
2016-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |