| abstract |
A semiconductor package device comprises a first dielectric layer, a first conductive pad and a first conductive element. The first dielectric layer has a first surface and a second surface opposite to the first surface. The first dielectric layer defines a first opening tapered from the first surface toward the second surface. The first conductive pad is within the first opening and adjacent to the second surface of the first dielectric layer. At least a portion of the first conductive element is within the first opening. The first conductive element is engaged with (e.g., abuts) a sidewall of the first opening, the first conductive element having a first surface facing toward the first conductive pad, wherein the first surface of the first conductive element is spaced apart from the first conductive pad. |