| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa6e4421d9e1159b6012d9bf702be572 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2016-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cefe1f7bd2c2a8f9a6e66874624933
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc01caff6ce29a3220c017df7f0087de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed57131b4dfe2ad2d3243e27db0bca2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50340b1e09ddcdfffda031bee5173583 |
| publicationDate |
2019-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10266730-B2 |
| titleOfInvention |
Thermally and electrically conductive adhesive composition |
| abstract |
[Solution] Provided is a thermally and electrically conductive adhesive composition, comprising: (A) an electrically conductive filler; (B) an epoxy resin; (C) a curing agent, and (D) an organic solvent, in which the electrically conductive filler (A) is a submicron fine silver powder, and the content of the electrically conductive filler (A) is such that (A)/(B) is 96.0/4.0 to 99.5/0.5 in the mass ratio to the content of the epoxy resin (B); and the epoxy resin (B) comprises at least a bisphenol-type epoxy resin and a novolac-type epoxy resin; and the curing agent (C) is diaminodiphenyl sulfone and/or a derivative thereof, and the content of the curing agent (C) is 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11118089-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11437162-B2 |
| priorityDate |
2015-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |