Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-40117 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66484 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4234 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-792 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-1157 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate |
2017-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc510405f4156ad5b46c0912d9d3724b |
publicationDate |
2019-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10243085-B2 |
titleOfInvention |
Semiconductor device and method of manufacturing same |
abstract |
An object is to provide a reliability-improved semiconductor device having a MONOS memory that rewrites data by injecting carriers into a charge storage portion. When a memory gate electrode having a small gate length is formed in order to overlap a carrier injection position in write operation with that in erase operation, each into an ONO film including a charge storage portion, the ONO film is formed in a recess of a main surface of a semiconductor substrate for securing a large channel length. In a step of manufacturing this structure, control gate electrodes are formed by stepwise processing of a polysilicon film by first and second etching and then, the recess is formed in the main surface of the semiconductor substrate on one side of the control gate electrode by second etching. |
priorityDate |
2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |