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filingDate 2016-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10224229-B2
titleOfInvention Double layer release temporary bond and debond processes and systems
abstract A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
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